WaferPRO™ plus

High Speed Large Area Stud Bumper

The world leader in gold ball bonding technology has taken stud bumping speed, precision and flexibility to even greater heights with the introduction of the new WaferPRO™plus Large Area Stud Bumper. The only system that allows single pass processing of 300 mm wafers and can ensure planarity to ±2.5 µm, the K&S WaferPROplus can completely eliminate a separate coining process.

The WaferPRO™ plus Advantage

• Up to 22 bumps per second dependent on bump type, size and pitch
• ±5 µm positional accuracy at 3 sigma
• Bump pitch down to 65 µm
• Planarity to ±2.5 µm with AccuBump™ feature
• Large table travel handles 12” wafers in a single pass
• Wide selection of manual chucks and fully-automatic wafer handling options

The AccuBump feature shears the tail from studs, ensuring device planarity to ±2.5 µm.

Uniform stack bumping with the versatile WaferPROplus system

High-Speed, Single-Pass Bumping of Wafers to 300 mm!

Speeds of up to 22 bumps per second at pitches down to 65 µm with an accuracy of ±5 µm are just the tip of the iceberg when it comes to describing the cutting edge capability of the WaferPROplus Stud Bumping System. With the largest table travel in the industry (400 mm x 330 mm), the WaferPROplus  can handle 300 mm wafers in a single pass, without rotation or the need to load a separate bumping program.

In addition, when supplied with our innovative AccuBump™ feature, studs are sheared to a uniform planarity of ±2.5 µm, eliminating the need for a separate coining operation and dramatically increasing throughput. With a complete line of fully automatic material handling solutions and manual chucks, the WaferPROplus is the industry’s most flexible and affordable wafer bumping solution.