AT Premier™
Advanced Technology Stud Bumper
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Copper bumping capability
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The new AT Premier™ Stud Bumper from K&S offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications.
Using industry-standard modeling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to competitive stud bumping technology.
A Premier Value in Cost-of-Ownership
The AT Premier takes stud bumping productivity to a whole new plateau enabling applications that were previously limited to mass solutions. Offering the fastest bumping speeds in the market along with the smallest footprint, AT Premier maximizes the use of resources and clean room space. Stud bumping on the AT Premier platform is flexible enough for rapid prototyping and scalable for production.
Its “premier” performance is highlighted by the following features:
- Quantum Leap in Bump Speed
- Easy-to-Use & Robust Wafer Mapping
- Low-Impact Force for Bond Control
- Bump Shape Process Flexibility
- Short Product Changeover Time
- Smallest Footprint In The Market
- Step-and-Repeat and Circle Teach Programming
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Wafer Mapping ensures that only good die are bonded.
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Wafer Mapping Capabilities identify good die before bonding!The AT Premier's unique wafer mapping system helps you reduce production costs by bonding only known good die.
K&S has partnered with industry-leader Kinesys ALPS™ software to bring you a flexible Wafer Mapping capability. The system reads the ID for each wafer, accesses the associated wafer map, and bonds only those die designated as good. The updated map is then uploaded once the wafer is fully bonded. The system can be standalone or networked, and wafers can be grouped into lots for maximum production efficiency.
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| The K&S AccuBump™ feature shears the tail from studs to ensure device planarity to ± 3 µm. |
Standard bump with tail. |
Uniform stack bumping can also be performed. |
Operators can easily create new bond programs using Circle Teach, and Step and Repeat features. A flexible wafer-mapping interface enables bumping of known good die. Production data can be collected at the wafer level for statistical analysis. Stud bumping technology does not require under bump metallurgy, and bonding can be executed at much finer pitch than solder. The increased speed and superior technological capabilities of the AT Premier contribute to a lower cost of ownership that allows crossover into new device technologies and applications as shown in the following graph:
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