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Bonding Tools

K&S Bonding Tools, a leading player in the semiconductors assembly industry, with over 40 years of experience.

We develop and manufacture advanced bonding tools for a broad range of applications, providing end-to-end solutions to a wide array of clients who are all market leaders in their respective fields.

 

Our product offerings varies from standard design to special solutions which address different packaging challenges and application conditions.


 

Bonding Tools Product Offerings


 

iCapPSTM
Step Forward into Fine Copper Wire Bonding
Takes the lead in 2nd Bond Performance
For low-K & other sensitive devices
NEXXUS™ & ARCUS™ Capillaries
Ultra fine pitch capability
Value Cap
ARCUS Capillary
CuPRA3GTM
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Capillary Tech-Central
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