Process Technologies

• Today's advanced devices are based on emerging technologies such as 3-D packaging, copper bonding, low-k dielectrics and many more. Explore these new frontiers, and discover  how Kulicke & Soffa can help your company stay ahead of the technology curve!
• For more information, see the International Technology Roadmap,  "a cooperative effort of the global industry manufacturers and suppliers, government organizations, consortia, and universities to identify the technological challenges and needs facing the semiconductor industry over the next 15 years."  (source:  ITRS Website).
  

Stacked Die	Copper	Low-k Dielectrics
Ultra Fine Pitch	Wafer Stud Bumping