Bump Specifications

K&S can tailor the process to fit the application through variation of capillary style, free-air-ball formation, and program parameters.

	Standard Stud Bump	K&S AccuBump
Height Consistency	+15 um (note 1)	+< 3 um
Productivity (bumps/second) (note 2)	36 bps	30 bps
Pitch (with 25 um wire)	50 um std	50 um std
Capillary	Application Specific
Wire type	AW6: Delivers consistent and reproducible tailing length and ball height for reliability and high performance in advanced interconnect packages. AW9: Consistently short tailing across various FAB settings, suitable for all bumping applications. Exhibits excellent bondability on sensitive pads.

Note 1: Actual achievable consistency typically better, determined by wire size and EFO conditions.
Note 2: Productivity excludes PRS & index time.