Stud Bumping



Stud Bumping for Flip Chip – An Alternate Strategy Published March 2005 Matt Osborne, Jamin Ling, Cuong Huynh, Ivy Qin & Vincent McTaggart Stud bumping offers a cost-effective, high-yield, Pb-free and well-established alternative to solder bumping for flip chip packaging. Presented at IMAPS Device Packaging Conference: Mar 2005 Download
Stud Bump Bonding Published February 2005 Laurie S. Roth and Vince McTaggart The stud bump process is mainly performed at the wafer level for volume production applications. This process can be used for singulated die, but is less attractive for volume production because of the additional handling time and the risk of damaging bare die. Published in Advanced Packaging Magazine: Feb 2005 External Link
Stud Bumping and Die Attach for Expanded Flip Chip Applications Published October 2004 Vince McTaggart, Lee Levine and Gene Dunn A good form factor and excellent electrical performance are enabling flip chip bonding to emerge as one of the high growth areas of semiconductor assembly. Growth of this bonding technique will accelerate as substrate prices fall and a manufacturing infrastructure is developed. Published in Advanced Packaging Magazine: Oct. 2004 Download
A Comparison of the Stud Bumping Performance of 4N and 2N gold wire Published January 2003 Tok Chee Wei, Chen Hui Hui, Klaus Dittmer, Christopher Breach and Frank Wulff Gold wire stud-ball-bumping (SBB) is not just an ideal technology for low volume prototype manufacturing using single dies or wafers, but is equally suited for low to medium volume manufacturing. Presented at SEMICON Singapore 2003 Download